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What are the hazards of ESD in SMT chip processing
Time:2021-10-08 Read: 1336

ESD is the abbreviation of electronstatic discharge in English. The original meaning is electrostatic discharge, and usually refers to the protection of electrostatic discharge (that is, what we usually call electrostatic protection or anti-static)

The rapid development of electronic technology has made electronic products more powerful and smaller in size, but this is all at the cost of increasing electrostatic sensitivity of electronic components. This is because the high level of integration means that the unit circuit will become narrower and the ability to withstand electrostatic discharge is getting worse and worse. In addition, the materials used in a large number of newly developed special devices are also electrostatic sensitive materials. Electronic components, especially semiconductor material devices, have higher and higher requirements for static control in the process environment of SMT processing chip production, assembly and maintenance.

In the SMT processing, production, use and maintenance of electronic products, various polymer materials that are prone to static electricity will be used in large quantities, which undoubtedly brings more problems and challenges to the electrostatic protection of electronic products.

Although humans have discovered static electricity for thousands of years, for the electronics industry, electrostatic protection is far from simple as imagined.

(1) The complexity of materials and articles in the SMT processing patch production process:

In the manufacturing of electronic products, semiconductors, metals, various packaging materials, circuit board substrates, casings, bases and other materials are used in the process of component SMT processing and mounting production to assembly, and then to use and maintenance. Equipment, operating tools, operating environment, packaging containers, etc. will make the items and materials that may come into contact with electronic devices more diverse. The contact separation, friction, induction, etc. between materials will generate static electricity, and many of these items use polymer insulating materials that are prone to static electricity and are difficult to eliminate. These will undoubtedly increase the risk of electrostatic damage and electrostatic protection of electronic products. The difficulty.

(2) There are many SMT processing and production links for electronic products, and the failure of any link will cause the failure of electrostatic protection

The manufacturing process of electronic products, from semiconductor materials to final assembly, has to go through multiple links such as semiconductor manufacturing, wafers, mounting, fixing, bonding, packaging, circuit board production, SMT processing, mounting, soldering, insertion, assembly, and testing. There are hundreds of processes from different manufacturers in each link, and static electricity on any link may cause damage to the device. Once the electrostatic protection of any link is not enough, it means that there is a problem with the final product. The systematic control of static electricity in the whole process is also an important feature of static protection in the electronics industry.

(3) Personnel factors in the production of SMT processing patches will increase the difficulty of electrostatic protection:

Although the degree of automation in the production of modern electronic products is getting higher and higher, it is impossible to operate without personnel during the entire manufacturing process. Compared with machines and equipment, the activities of people are much more complicated, and the operation of devices by people is much more complicated. Therefore, the protection of human body static electricity is much more complicated than that of equipment and the environment. At the same time, people are the masters of production, and the anti-static awareness of personnel and the operation level of electrostatic protection will ultimately determine whether the electrostatic protection is effective. These will increase the difficulty of electrostatic protection.

(4) SMT processing devices are becoming more and more sensitive, and the requirements are becoming more and more stringent:

The advancement of electronic technology can be said to be the improvement of integration and the use of new semiconductor materials. The improvement of integration means that the ability of the device to withstand electrostatic breakdown is reduced. The line width of today's integrated circuits has dropped to 45nm, which means that the theoretical breakdown resistance calculated according to 10MV/CM is limited to 45V, which may be only 1/20 of the static voltage generated when we bend over and pick up a piece of paper, and others Fields, such as the production of the hard disk industry, the requirements for static control have dropped below 5V, which must pose new challenges for static protection.

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