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Automatic 3D solder paste inspection SPI REFINE-XS
Time:2021-10-09 Read: 526

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Features:

3D solder paste measurement based on white light sine fringe PMP technology;

The detection accuracy of solder paste height can reach 1um;

Automatically rebuild the 3D data of the pads on the PCB surface, and calculate the volume, area, height and offset of each solder paste.

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Shenzhen Ledfocus Precision Manufacturing Co., Ltd.

Address: Room 1204, Dahong (Xinqiao) Science and Technology Innovation Park, No. 48, Xinyu Road, Shajing Street, Baoan District, Shenzhen

Phone: 0755-29727486 0755-83734215 0755-83734236

Person in charge: Mr. Fan 13088821718

Email: roman@leikashi.com

Business section #605

Email: allen@leikashi.com

Website: www.leikashi.com

Service hotline
0755-83734236
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