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SMT贴片加工中保证质量的细节
Time:2024-01-04 Read: 529

SMT贴片加工中保证质量要留意些什么,在以下细节中必要留意的是: 


1. Mark点为圆形或方形,直径为1.0mm,可根据SMT的配备而定,Mark点到周围的铜区需大于2.0mm,Mark点不允许折痕、脏污与露铜等等; 

2. 每块大板上四角都必必要有Mark点或在对角需有两个Mark点,Mark点离边缘需大于5mm;

3. 每块小板都必需有两个Mark点; 

4. 根据细致的配备和效能评价,FPC拼板中不允许有打“X”板; 

5. 补板时症结地域用宽胶纸将板与板粘巩固,再查对胶卷,若补好板不平整,须再加压一次,重新再查对胶卷一次; 

6. 0402元件焊盘间距为0. 4mm;0603和0805元件焊盘间距为0.6mm;焊盘最益处置成方形; 

7. 为了避免FPC板小面积地域由于受冲切下陷,从底面倾向冲切; 

8. FPC板制造好后,必需烘烤后真空包装;SMT上线前,[敏感词]要预烘烤; 

9. 拼板尺寸[敏感词]为200mmX150mm之内;

10. 拼板板边须留有4个SMT治具定位孔,孔径为2.0mm; 

11. 拼板边缘元件离板边最小距离为10mm; 

12. 拼板分布尽量每一个小板同向分布; 

13. 各小板金手指地域(即热压端和可焊端)拼成一片,以避免SMT消费中金手指吃锡; 

14. Chip元件焊盘之间距离最小为0.5mm。 
SMT贴片加工

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